HTC One拆解图集全铝合金机身

2013-03-30 10:35

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标签： HTC One iPhone5

HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构（外部无一颗螺丝）；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机。

HTC One拆解图集全铝合金机身

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                "setname": "HTC One拆解图集 全铝合金机身",
                "imgsum_bk": 24,
                "imgsum": 24,
                "lmodify": "2013-03-30 10:35:50",
                "prevue": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构（外部无一颗螺丝）；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机。",
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                    "seturl": "/photoview/2ERI0011/41436.html"
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                {
                   "id": "8R70GEMO2ERI0011",
                   "img": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GEMO2ERI0011.jpg",
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                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GEMO2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-01",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。",
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                ,
                {
                   "id": "8R70GETB2ERI0011",
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                   "osize": {},
                   "title": "HTC One拆机图-02",
                   "note": "HTC One配置：全铝合金一体式机身结构",
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                }
            
                ,
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                   "osize": {},
                   "title": "HTC One拆机图-03",
                   "note": "4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
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                ,
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                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GG302ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-04",
                   "note": "与iPhone 5相比，HTC One略显厚重，最薄处9.3mm，长度137.4mm",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "8R70GGD72ERI0011",
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                   "osize": {},
                   "title": "HTC One拆机图-05",
                   "note": "HTC One背面采用铝合金材质，弧线形设计更符合人体工程学，握感更舒适。",
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                }
            
                ,
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                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GH492ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-06",
                   "note": "HTC One采用整机无缝设计，需要用吸盘将屏幕去下，方可看到内部结构，外部无一颗螺丝。",
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                   "osize": {},
                   "title": "HTC One拆机图-07",
                   "note": "可以很清晰看到HTC One屏幕下方也没有需要拆解的螺丝，也没有看到连接屏幕的线路，",
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                   "osize": {},
                   "title": "HTC One拆机图-08",
                   "note": "揭开屏幕下方的散热薄膜，我们可以看到机器的主板和排线。",
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                   "osize": {},
                   "title": "HTC One拆机图-09",
                   "note": "将屏幕轻轻取出。",
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                   "title": "HTC One拆机图-11",
                   "note": "背板周围使用塑料物保护，有利于减小冲击、增加散热。",
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                   "osize": {},
                   "title": "HTC One拆机图-12",
                   "note": "背板采用整铝无缝技术打造，可以看到制造编号和日期。",
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                   "osize": {},
                   "title": "HTC One拆机图-13",
                   "note": "拆除电池与主板连接排线。",
                   "newsurl": "#"
                }
            
                ,
                {
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                   "img": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GKUG2ERI0011.jpg",
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                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GKUG2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-14",
                   "note": "取下电路主板，电池位于下方，通过薄铜片隔离。",
                   "newsurl": "#"
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                ,
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                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GLKB2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-15",
                   "note": "薄铜片增加散热，避免过热。",
                   "newsurl": "#"
                }
            
                ,
                {
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                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GLV12ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-16",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
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                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GMF92ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-18",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
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                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GN382ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-19",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
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                   "simg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GNEB2ERI0011.jpg",
                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GNEB2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-20",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "8R70GNU92ERI0011",
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                   "timg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GNU92ERI0011.jpg",
                   "simg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GNU92ERI0011.jpg",
                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GNU92ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-21",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "8R70GOLM2ERI0011",
                   "img": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOLM2ERI0011.jpg",
                   "timg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOLM2ERI0011.jpg",
                   "simg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOLM2ERI0011.jpg",
                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOLM2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-22",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "8R70GOVH2ERI0011",
                   "img": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOVH2ERI0011.jpg",
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                   "oimg": "http://img3.cache.netease.com/photo/0011/2013-03-30/8R70GOVH2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-23",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
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                   "img": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPJH2ERI0011.jpg",
                   "timg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPJH2ERI0011.jpg",
                   "simg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPJH2ERI0011.jpg",
                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPJH2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-24",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "8R70GPUI2ERI0011",
                   "img": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPUI2ERI0011.jpg",
                   "timg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPUI2ERI0011.jpg",
                   "simg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPUI2ERI0011.jpg",
                   "oimg": "http://img4.cache.netease.com/photo/0011/2013-03-30/8R70GPUI2ERI0011.jpg",
                   "osize": {},
                   "title": "HTC One拆机图-25",
                   "note": "HTC One作为HTC今年旗舰型产品一经发布即受广泛关注，整体采用无缝设计，外部没有使用一颗螺丝，其内部有何独到之处呢，就让我们看看拆解图。HTC One配置：全铝合金一体式机身结构；4.7英寸显示屏，468PPI；高通600四核1.7GHz CPU；2GB DDR2 RAM；400万像素UltraPixel摄像机；HTC BoomSound",
                   "newsurl": "#"
                }
            
            ]
        }