iPhone X拆解报告：设计紧凑/结构复杂

2017-11-05 16:02

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标签： iPhone X 苹果拆解网易手机 163

iPhone X正式发售后，拆解内容第一时间为大家出炉，整体来看，iPhone X的设计十分紧凑，同时结构异常复杂，维修难度进一步提升。

iPhone X拆解报告：设计紧凑/结构复杂

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                   "note": "拆除底部7颗螺丝",
                   "newsurl": "#"
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                ,
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                ,
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                   "note": "抽出4根电池易拉胶",
                   "newsurl": "#"
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                ,
                {
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                   "note": "取下电池",
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                   "note": "取下顶部原深感摄像头模组",
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                   "title": "iPhone X拆解报告",
                   "note": "iPhone X后置双摄采用双1200w广角和长焦的搭配，双像头都支持光学防抖，体积相对于iPhone 8Plus大很多。",
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                   "note": "扬声器体积通过排线连接，相对于iPhone 8Plus变小，为电池腾出空间。",
                   "newsurl": "#"
                }
            
                ,
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                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "这个挡板起到固定作用，同时背面还有连接排线，还起到接地和天线连接的功能。",
                   "newsurl": "#"
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                ,
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                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "同样为了给电池腾出空间，Taptic Engine变小，但是厚度增加。",
                   "newsurl": "#"
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                ,
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                   "note": "采用双层叠加封装技术的iPhone X主板高度集成,相对于iPhone 8Plus，面积减小减小30%。正反面都贴有散热贴纸，正面14个排线接口。",
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                   "title": "iPhone X拆解报告",
                   "note": "依次是红外像头、前置像头和点阵投影器,配合泛光感应元件，组成原深感摄像头模组.原理是泛光感应元件配合前置像头识别到面部，点阵投影器投射出30000个肉眼不可见光点投影在面部，通过红外像头捕捉面部点阵图案，再将数据送到A11仿生处理器，匹配面部数据，完成Face ID解锁或者景深自拍和Animoji等功能。",
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                ,
                {
                   "id": "D2G709UR5QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UR5QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UR5QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UR5QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UR5QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "玻璃后盖使用胶水粘贴在金属背板，金属背板使用激光点焊固定在不锈钢边框。中间黑色是无线充电线圈。边框的顶部和底部依然是iPhone X的射频天线，不同的是由于iPhone X的主板构造，射频同轴线一端连接到天线，一端连接到主板。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709US5QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709US5QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709US5QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709US5QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709US5QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "顶部的扬声器通过导管将声音导出，同时和底部扬声器组成双声道。这个还集成麦克风、泛光感应元件、环境光传感器、距离传感器。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709UT5QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UT5QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UT5QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UT5QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UT5QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "iPhone X使用了两块电池，MacBook&iPad有类似的设计，为了充分利用手机内部空间。2716mAh，欣旺达电子代工。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709UU5QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UU5QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UU5QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UU5QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UU5QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "iPhone X的屏幕使用OLED材质，5.85寸分辨率2436*1125，这块异型切割的OLED屏幕总成厚度仅有1.78mm，为主板和电池腾出更多空间，同时更加省电。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709UV5QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UV5QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UV5QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UV5QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709UV5QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "这次苹果首次采用双层封装，使得iPhone X主板占用机身内部更少面积。为其他元件腾出空间。这种封装技术含量很高，难度很大。同时后期维修难度也很大。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709V05QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V05QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V05QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V05QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V05QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "A板主要是逻辑运算和控制芯片，包含A11仿生处理器、存储芯片、电源管理芯片等。",
                   "newsurl": "#"
                }
            
                ,
                {
                   "id": "D2G709V15QJ60011NOS",
                   "img": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V15QJ60011NOS.jpg",
                   "timg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V15QJ60011NOS.jpg",
                   "simg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V15QJ60011NOS.jpg",
                   "oimg": "http://pic-bucket.ws.126.net/photo/0011/2017-11-05/D2G709V15QJ60011NOS.jpg",
                   "osize": {},
                   "title": "iPhone X拆解报告",
                   "note": "B板主要是射频芯片，包含基带处理器、射频处理芯片、射频前端芯片和Wi-Fi芯片等。iPhone X的芯片组与iPhone 8大致相同，但是双层叠加的封装，难度大很多。",
                   "newsurl": "#"
                }
            
            ]
        }